When the IBM PC and shoulder pads were big, Japan led the chip industry. It's trying to get back there now

Rapidus aims for a rapid comeback

It has been reported that Rapidus is on track to begin mass production at a 2nm wafer fab in Hokkaido in the second half of 2027 — just five years after the company was founded. Pilot production at the IIM‑1 plant has already started on 300mm wafers using gate‑all‑around transistor tech. Nostalgia aside — when IBM PCs ruled and shoulder pads were a thing — this is about industrial muscle and supply‑chain sovereignty, not retro fashion.

Packaging, partners and process shortcuts

Instead of trying to reinvent the wheel, it has been reported that Rapidus struck a deal with IBM to commercialize its 2nm process technology from Albany, shorthand that speeds a painful part of foundry-building. But manufacturing chips today is more than shrinking transistors. Rapidus is also pushing advanced packaging and chiplet work — its 600mm‑square redistribution‑layer interposer and a new analysis facility are meant to stitch dies together and solve heat, power and space problems.

Stakes, speed and the wider race

Speed has been the startup’s selling point: fresh leadership, no legacy baggage, and a three‑pronged approach spanning manufacturing, partner prep and process readiness. Meanwhile, TSMC’s expanding presence in Japan underscores that Rapidus won’t be alone in the neighbourhood. Can a newcomer outpace giants who've been at this game for decades? It’s a tall order — but for Japan, this isn’t just business; it’s a bit of national pride trying to find its footing again.

Sources: The Register